6" Polyurethane (PU) Cerium Oxide Polishing Pads

The Polyurethane Cerium Oxide Polishing Pad is crafted from a hydrophobic natural polyurethane (PU) substrate embedded with finely dispersed cerium oxide particles. Designed for ultra-precise surface polishing, it achieves sub-micron accuracy while minimizing thermal impact on heat-sensitive materials. Its open-cell porous structure effectively retains cerium oxide slurry while shedding excess water, significantly reducing heat and friction during polishing. Ideal for complex contours and precision workpieces requiring ultra-fine finishing.
Material & Construction
Hydrophobic Polyurethane Substrate: Resists water absorption, ensuring stable performance in both wet and dry polishing conditions.
Cerium Oxide Dispersion: Uniformly distributed particles within the porous structure enable continuous self-sharpening cutting action.
Thickness Range: 0.5 mm to 5 mm (standard thickness: 1.25 mm).
Hardness Range: 78–90° Shore A, balancing flexibility and cutting efficiency.
Key Advantages
Efficient Heat Dissipation: Open-cell structure reduces frictional heat, minimizing deformation risks for heat-sensitive materials (e.g., optical crystals, semiconductors).
High-Precision Finish: Combines cerium oxide with uniform wear characteristics to deliver mirror-like finishes and rapid material removal.
Contour Adaptability: Medium-density foam layer with a plastic core conforms to complex geometries, ensuring tight tolerance adherence.
Multi-Scenario Compatibility: Supports magnetic backing, PSA adhesive, or non-adhesive mounting options for integration with various polishing equipment.
Applications
Precision Optics: Sub-micron surface polishing of optical lenses, prisms, laser crystals, and more.
Semiconductors & Electronics: Planarization of silicon wafers, hard disk platters, and LED/LCD substrates.
Glass Products: Scratch-free, high-transparency polishing for display panels and precision glass instruments.
Metals & Composites: Dimensional stability polishing for stainless steel, aluminum, and other precision components.
Specifications
Sizes: Round pads from 4″ to 24″ (custom shapes available).
Backing Options: Magnetic, PSA adhesive, or non-adhesive.
Weight: Approximately 2.5 kg per carton for large pads; individual pad weight varies by size.
Usage & Maintenance Guidelines
Pre-Activation: Run the pad on a medium-hard preform for 1–2 minutes to fully expose cerium oxide particles.
Coolant Management: Maintain consistent slurry flow to prevent pad glazing.
Cleaning & Storage:
Rinse with deionized water post-use; avoid solvents that degrade PU material.
Store flat in a dry environment to prevent deformation or contamination.
Combining hydrophobic design, thermal stability, and high-precision polishing capabilities, the Polyurethane Cerium Oxide Polishing Pad is an ideal choice for semiconductor, optical, and precision manufacturing industries. It meets stringent process requirements while enhancing efficiency and surface quality.